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Glossary

Electronic Devices

[ Semiconductor ]

Assembly process: The packaging and final test process that follows the chip-fabrication process in the overall semiconductor production processes.

Bit: Short for 'Binary Digit, the smallest piece of data that a computer recognizes, represented by "1" and "0" which, in various combinations, represent characters and numbers. 8 bits = 1 Byte.

BiCS: Bit-cost scalable.

BSI: Back-Side Illumination. BSI sensors deploy lenses on the rear of the sensor, on its silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption and allows formation of finer image pixels in smaller CMOS image sensors. BSI is suited to high-resolution applications.

Byte: 1 Byte = 8 bits.

CMOS image sensor: Complementary metal-oxide semiconductor image sensor. The image sensors are generally used in mobile devices and digital still cameras.

Discrete: A single-function semiconductor device, such as a transistor or diode, mounted in an individual package.

Fab: Fabrication facility.

GaN: Gallium Nitride.

LED: Light-Emitting Diode.

MCP: Multi-Chip Package. NAND flash memory that can contain multiple bits in a single cell.

MLC: Multi-Level Cell.

NAND flash memory: A kind of non-volatile memory device that can retain data when switched off.

Nanometer: nm (1 billionth of a meter).

Power devices: A kind of discrete devices designed to handle high voltages and currents.

Post-NAND memory: Alternative memory to current NAND flash memory that consists of planar NAND cells.

Process technology: Technology for the wafer-fabrication process. The technology node is defined by using the wiring pitch of integrated circuits (IC).

SiC: Silicon Carbide.

SLC: Single-Level Cell. NAND flash memory that can only contain a single bit in a single cell.

SoC: System-on-Chip.

System LSI: System LSI are large-scale integrated circuits that incorporate special or plural functions.

Yokkaichi Operations: Toshiba's production base for NAND flash memory. Yokkaichi currently operates three 300mm wafer fabs: Fab 3, Fab 4 and Fab 5.

Wafer fabrication process: The chip-fabrication process in the overall semiconductor production process, prior to the assembly process.

[ Storage ]

eSSD: enterprise Solid State Drive. An eSSD has a very high data transfer rate. eSSD are used as Tier 0 storage together with traditional enterprise HDDs as Tier 1 and near line HDDs as Tier 2 and 3 in tiered enterprise storage systems. See SSD

Near-line HDD: A kind of enterprise-use HDD that has high capacity and lower rotation speed and power consumption than traditional enterprise HDDs. Used as Tier 2 and/or Tier 3 storage in tiered storage system.

SSD: Solid State Drive. Toshiba markets SSD for digital consumer products, such as PCs, and enterprise applications, such as servers. SSD for enterprise applications are called eSSD. SSD for PC and consumer products are called cSSD to clarify the difference from eSSD.

Traditional enterprise HDD: An enterprise-use HDD historically used for server and storage systems. These HDDs has high rotation speeds such as 10,000-15,000 rpm and transfer data at high rates.

This Web site contains projections of business results, statements regarding business plans and other forward-looking statements. This information is based on certain assumptions, such as the economic environment, business policies and other factors, as of the date when each document was posted. Actual results may differ significantly from the estimates listed here.

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