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Toshiba Starts Marketing Second Generation 64-megabit DRAMs

23 May, 1996


Tokyo--Toshiba Corporation today announced that it will start worldwide marketing of second generation 64-megabit DRAMs (dynamic random access memories). Sample shipment will start next month at a price of 50,000 yen and mass production is scheduled to start this autumn at Toshiba's Yokkaichi Works.

The new TC5164 series is a line-up of leading-edge products offering high speed and low power consumption. Use of EDO (Extended Data Out) allows the devices to achieve an access time of 40 nanoseconds, the world's fastest speed in this class of device, while maintaining power consumption at a low level of 1cc1=100mA operating at around 3.3V. Products are available in a range of multibit-configurations: 16-megaword (M) x 4-bit, 8M x 8-bit and 4M x 16-bit.

The 64Mb synchronous DRAM, a derivative of the second generation 64Mb DRAM, is in the final stage of development and is slated for introduction to the market early next year.

The products are fabricated utilizing 0.35 micron CMOS processing technology. The new series offers better performance than first generation devices, even while cutting the chip area by around 25 percent, to achieve a size of 167 square millimeters. They are available in 400-mil 32-pin SOJ/TSOP (x4/X8) packages and 50-pin SOJ/TSOP (x16) packages.


Technological Advantages

These advanced products are the result of a co-development project with IBM and Siemens. The 64Mb DRAM utilizes basically the same trench memory cell design that is used in the jointly developed 256Mb DRAM. Capabilities and technologies developed in the 256Mb DRAM project were applied to the 64Mb DRAM, contributing to smooth and efficient development of compact, reliable chips.

Major technologies contributing to chip performance include: Shallow Trench Isolation narrows the gaps between each transistor by utilizing an oxidized isolation wall to assure isolation; Chemical Mechanical Polishing which supports precise processing of the chip by polishing the chip surface before each patterning process.

Toshiba, IBM and Siemens began their 256Mb DRAM joint development program at IBM's facility in Fishkill, New York in January 1993. The program was extended to cover development of second generation 64Mb DRAM in mid 1994.


Product Outline

Models TC5164405AJ/AFT (16M x 4- bit)
TC5164805AJ/AFT (8M x 8-bit)
TC5164165AJ/AFT (4M x 16-bit)
Fast page modes EDO (Extended Data Out), FPM (Fast Page Mode)
Design rule 0.35 micron CMOS process
Chip size 167.7 square milimeters
Memory cell Trench capacitor cell
Bit configuration x4, x8, x16- bit
Package 400-mil 32-pin SOJ/TSOP (x4/ x8)
400-mil 50-pin SOJ/TSOP (x16)
Voltage 3.3V +/- 0.3V
Power consumption less than 100mA
Speed Access time = 40ns/50ns
Hyper page cycle time=16ns (62.5MHz)


Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement,but is subject to change without prior notice.

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