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DNP and Toshiba Establish Joint Venture in Printed Circuit Boards

3 October, 2000

Dai Nippon Printing Co., Ltd.
Toshiba Corporation

Dai Nippon Printing Co., Ltd. (DNP) and Toshiba Corporation today announced the October 1 establishment of a joint-venture company, D.T. Circuit Technology Co., Ltd. The new company will begin operations on November 1 and will develop, produce and market build-up boards and functional circuit modules.

Establishment of the new company is based on a July, 2000 agreement between the two parties. Under its terms, Toshiba transferred its business in printed circuit boards*1 and functional circuit modules*2 to Toshiba Circuit Technology Corporation, a Toshiba Group subsidiary engaged in the design, blanking and inspection of printed circuit boards. Toshiba subsequently increased Toshiba Circuit Technology's capital and DNP acquired a stake in the company to establish the joint venture.

Demand for build-up boards, high density printed circuit boards*3, is expected to correlate with increased demand for high-speed, high-density LSI for incorporation into cellular phones, personal-computer-related products and digital AV equipment. By combining Toshiba's B2itTM technology*4 for high-density, multi-layer printed boards with DNP's advanced fine pitch wiring technology, the joint-venture company will provide the market with highly competitive products. Through a close focus on its core business in build-up boards, D.T. Circuit Technology Co., Ltd. aims to reach annual sales of 25 billion yen in the next three years.

Profile of the New Joint Venture Company

Company NameD.T. Circuit Technology Co., Ltd
Headquarters2-1, Toshiba, Fuchu, Tokyo
Capital1 billion yen
ShareholdingDNP 51%; Toshiba 49%
PresidentKunihiko Okabe,
Former President of Dai Nippon LSI Design Co., Ltd
Vice PresidentYouichi Tahara
Vice President of Printed Circuit Board & Module Division, Toshiba Corporation's Semiconductor Company.
Former President of Toshiba Circuit Technology Corporation
EmployeesApproximately 310*
*Approximately 170 from Toshiba
*Approximately 140 from Toshiba Circuit Technology
*Plus a number from DNP
Production SiteToshiba's Fuchu Complex


*1 Printed Circuit Boards: Boards in which printing technology creates conductive wiring inside or on the surface of an insulator.

*2 Functional Circuit Module: Multiple LSI bare chips and electronic components directly loaded on a board.

*3 Build-up boards: Printed circuit board with microscopic wiring. Wiring is created by building thin, insulating and conductive layers on a core board, and connecting the conductive layers by micro-via holes.

*4 B2itTM: Buried Bump Interconnection Technology connects board layers with conductor bumps. B2itTM is a registered trademark of Toshiba.

About Dai Nippon Printing Co., Ltd

Dai Nippon Printing (DNP) is the world's largest comprehensive printing company and the top vendor of high-tech photomasks and etching leadframes, both produced by applying fundamental printing techniques and technologies. Initially, the Company printed books and magazines but has since expanded its printing technology and diversified its operations to include packaging, decorative materials, electronic components, and information media supplies. DNP has 35,000 employees and its net sales in fiscal 1999 were over US$11 billion.

About Toshiba Corporation

Toshiba Corporation is a leader in information and communications systems, electronic components, consumer products, and power systems. The company's integration of these wide-ranging capabilities assures its position as an innovator in advanced components, products, and systems. Toshiba has 191,000 employees worldwide, and annual sales of over US$54 billion.

Press Contacts:

Rey Saida
Press and Public Relations
Dai Nippon Printing Co., Ltd.
Phone: ++81-3-5225-8220
Fax: ++81-3-5225-8239
Web site:

Midori Suzuki
Corporate Communications Office
Toshiba Corporation
Tel: +81-3-3457-2105
Fax: +81-3-5444-9202

Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement,but is subject to change without prior notice.

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