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Toshiba Single Chip Bluetooth(TM) Solution Integrates RF, Baseband and Mask ROM Circuits

9 December, 2002


Tokyo--Toshiba today announced a BluetoothTM LSI that integrates radio frequency (RF), baseband and mask ROM circuits on a single chip. The new LSI, TC35654, fully conforms to the BluetoothTM ver.1.1 specification.

Toshiba achieved the single-chip solution by using CMOS process technology for the RF circuit, not the usual bipolar process technology. Applying the same process technology to both circuits achieves an LSI that requires fewer external components and that can be housed in a 7 x 7mm Plastic Fine-Pitch Land Grid Array (PFLGA) package only 0.8mm high. Integrating mask ROM with RF and baseband circuits produces a single-chip solution takes up approximately 65% less space on a printed circuit board than separate RF, baseband and mask ROM circuit ICs. The built-in mask ROM replaces an external NOR flash memory and installs LMP/ HCI software for BluetoothTM operation. The resulting reduction of external components makes dramatic contributions to cost saving.

Toshiba will reinforce its leading role in BluetoothTM development and promotion by bringing the new IC to system-on-chip solutions for BluetoothTM IP-embedded application specific IC. In response to strong market demand, technology for high-speed connections that can shorten the initial connection time by approximately one third will be also developed and integrated into BluetoothTM LSI.

Samples of the new LSI will be available in February 2003 at 900 yen. Mass production is slated for July 2003 at an initial 50,000-units a month, a figure that is expected rise to 500,000 units a month by the beginning of 2004. Toshiba will also meet market demand by introducing a BluetoothTM RF IC, TB31296FT, based on SiGe Bi-CMOS technology. Samples will be available in December 2002.

The new LSI adopts BluetoothTM core circuit technology licensed from Nokia, the world leader in cellular phones, assuring highly reliable interoperability between multiple BluetoothTM-enabled platforms.

Major Specifications

Major Specifications


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