| TOSHIBA AND XILINX AGREE TO PURSUE JOINT DEVELOPMENT
OF 65NM FPGAs WITH A VIEW TO EXTENDED FOUNDRY RELATIONSHIP
6 December , 2005
SAN JOSE, Calif., December 5, 2005 and TOKYO, Japan, December 6, 2005 – Toshiba Corp., one of the world's leading manufacturers of semiconductors, and Xilinx, Inc. (NASDAQ: XLNX), the world's leading supplier of programmable logic solutions, today announced that they have entered into a joint development agreement for next-generation 65nm (nanometer)-generation FPGAs, which has resulted in successful production of 65nm FPGA prototype wafers, including actual programmable logic circuitries. Achievement of key 65nm joint development milestones is expected to lead to an expanded strategic foundry relationship.
Notably, Toshiba is among an elite few manufacturers worldwide that are now ready to produce 65nm products in volume, and the company is moving forward in research and development efforts at 45nm. The two companies will also investigate the possibility of continuing collaboration to include development of FPGAs based on Toshiba's 45nm process technologies.
Successful execution of a 90nm manufacturing agreement – inked in October 2004 – paved the way for continued collaboration between Xilinx and Toshiba at 65nm. Xilinx flagship 90nm Virtex-4 platform FPGAs are produced in volume at Toshiba's state-of-the-art 300-mm-wafer manufacturing plant at Oita, in Kyushu, Japan.
"Toshiba's reputation as a world leader in advanced process technologies and high quality manufacturing is indisputable – and over the past year, our 90nm manufacturing relationship has paid off for Xilinx and our customers," said Wim Roelandts, Xilinx chairman, president and CEO. "As process evolution forces newer and tighter collaborative efforts as well as innovative technical approaches, we are pleased to have a partner such a Toshiba that is in sync with these dynamics. We're forging ahead at 65nm with confidence, bolstered by the fact that Toshiba is an industry leader in 65nm technologies for digital consumer markets, and in research and development at 45nm and below."
"Xilinx has long maintained leadership in the FPGA industry by consistently introducing competitive products implementing cutting edge technologies. This is a perfect match with Toshiba," said Mr. Masashi Muromachi, President & CEO of the Semiconductor Company at Toshiba Corporation. "We are committed to developing the most advanced process technology and to achieving stable volume supply at world class yields in our state-of-the-art 300mm facility. This strategic relationship secures and reconfirms our technology leadership, and will give customers early access to innovative solutions."
The strategic foundry relationship with Toshiba not only assures Xilinx of another source of stable supply of cutting-edge FPGA products manufactured with the industry's most advanced process technology, it allows the company to rely on Toshiba's expertise in integrating high-level design and process technology, a critical aspect of designing for advanced process geometries. The relationship also assures Toshiba of volume semiconductor business in the most advanced technology from one of the world's leading fabless semiconductor companies, thereby underscoring the company's leadership in a significant segment of the system large scale integration (LSI) business.
Xilinx, one of the pioneers of the fabless semiconductor business model two decades ago, continues to be at the forefront of the race to advanced manufacturing processes, and has established an impressive track record, as one of the first to 150nm in 2001, 130nm in 2002, and 90nm in 2003. Xilinx continues to be one of the highest volume purchasers of 300mm wafers globally.
Xilinx FPGAs are ideally suited to prove and test advanced manufacturing processes, due to their regular structure and re-programmability. Defects can be more easily identified and isolated during manufacturing than with traditional, fixed semiconductor device architectures, making them an ideal process driver for a volume manufacturer such as Toshiba.
This release contains forward-looking statements and projections. Actual events and results may differ materially from those in the forward-looking statements and are subject to risks and uncertainties including the ability to develop and implement leading-edge manufacturing processes and techniques and the ability of the industry to develop and supply new equipment necessary for the production of leading-edge wafers.
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