Latest releases Search by month Search by subject
Toshiba and Kaga Toshiba celebrate the new opening of the new 200mm wafer-based production fab

15 October, 2007


Toshiba Corporation
Kaga Toshiba Electronics Corporation

TOKYO--Toshiba Corporation and Kaga Toshiba Electronics Corporation (Kaga Toshiba) today marked the official opening of a new semiconductor production fab based on 200mm wafers at Kaga Toshiba, a consolidated subsidiary of Toshiba based in Ishikawa prefecture, Japan. The new fab will enhance production capacity for power devices.

Demand is growing for power devices that control current flow and voltage conversion in digital consumer products, including TVs and personal mobile equipment, and hybrid vehicles. Toshiba and Kaga Toshiba's investment in the new production fab will increase capacity for these key devices.

The new fab came on-line at the end of September, completing the first phase of an investment program in a new building and production equipment that is expected to be total 55 billion yen in the five years from FY2006 to FY2010. The new fab is planned to ramp up to 60,000 wafers a month, and capacity may be further expanded to meet market growth. This new fab will reinforce Toshiba's drive to become the world's leading manufacturer of power devices.

Toshiba Group's well-balanced semiconductor business covers three major product areas: system LSIs, memories and discrete devices. Kaga Toshiba operates as a key Toshiba Group facility for discrete devices, carrying out product development and front- and back-end processes for small-signal devices and power devices.

"We promote investments that reinforce our position and capabilities in our core markets," said Mr. Keizo Tani, Executive Vice President of Toshiba's Semiconductor Company and Vice President of Discrete Semiconductor Division. "Alongside our proactive investments in NAND Flash memory at Yokkaichi Operations and cutting-edge LSI at Oita Operations, we are promoting this investment in Kaga Toshiba in order to expand our businesses in power devices, a key product area, and to reinforce the overall profitability of the semiconductor business."

Mr. Tatsuro Mitani, President of Kaga Toshiba Electronics, also welcomed the new facility: "Power devices have a very promising future," he said, "and this market-appropriate investment will strengthen our discrete business and allow us to generate sustained profit. Our goal now is to use this new fab to position Toshiba as the world leader in power devices."

Overview of Kaga Toshiba Electronics Corporation

Location : 1-1, Iwauchi-cho, Nomi-shi, Ishikawa Pref., Japan
Established : December 6, 1984
President and Representative Director : Tatsuro Mitani
Employees : Approx. 850
Capitalization : 3.3 billion yen (Wholly-owned subsidiary of Toshiba)
Main Products : Discrete semiconductors (small-signal devices and power devices)

Overview of new production fab

Structure of Building : Steel frame concrete, two stories
Total Floor Area : approx. 23,000m2
Start Construction : September, 2006
Completion : May, 2007
Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement,but is subject to change without prior notice.

Press Releases Top Page Copyright