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Toshiba Launches World’s Smallest-class Embedded NAND Flash Memory Products

Using cutting-edge 15nm process NAND flash memory chips
2 Oct, 2014

 

picture of new products

TOKYO—Toshiba Corporation (TOKYO: 6502) today announced the launch of the world’s smallest-class[1] embedded NAND flash memory products integrating NAND chips fabricated with cutting-edge 15nm process technology. The new products are compliant with the latest e∙MMCTM[2] standard, and are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16GB products start from today, with 8GB, 32GB, 64GB and 128GB products to follow.

The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm generation process technology and a controller to manage basic control functions for NAND applications in a single package.

By utilizing the 15nm NAND chips, the package size is approximately 26% smaller[3] than comparable Toshiba products[4]. They also offer faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately 8% faster (max.), while the write speed is approximately 20% faster (max.).

Demand continues to grow for NAND flash memory that can support applications such as smartphones and tablet PCs. This is particularly true for embedded memories with a controller, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

New Product Line-up

Product Name

Capacity

Category

Package

Mass Production

THGBMFG6C1LBAIL

8GB

Supreme

11.5x13x0.8mm

2Q, 2015 (Apr.-Jun.)

THGBMFG6C1LBAIT

8GB

Supreme

11x10x0.8mm

2Q, 2015 (Apr.-Jun.)

THGBMFG7C2LBAIL

16GB

Supreme

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG7C2LBAIW

16GB

Supreme

11x10x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG7C1LBAIL

16GB

Premium

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C4LBAIR

32GB

Supreme

11.5x13x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C4LBAIW

32GB

Supreme

11x10x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C2LBAIL

32GB

Premium

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C8LBAIG

64GB

Supreme

11.5x13x1.2mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C8LBAIX

64GB

Supreme

11x10x1.2mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C4LBAIR

64GB

Premium

11.5x13x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFT0CBLBAIS

128GB

Supreme

11.5x13x1.4mm

2Q, 2015 (Apr.-Jun.)

*In Toshiba e∙MMCTM categories, “Supreme” represents products suited to high-end class applications and “Premium” represents products for middle- and low-end class applications.

Key Features

1. The JEDEC e∙MMCTM compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features[5] among them BKOPS control, Cache Barrier, Cache Flushing Report, and Large RPMB Write, are applied to the new products to enhance usability.

2. The 8GB to 64GB products are sealed in a small FBGA package measuring just 11mm x 10mm and are suitable for smartphones, tablet PCs and wearable devices where miniaturization and weight savings are requirements.

3. Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video[6].

Key Specifications

Interface

JEDEC e∙MMCTM V5.0 standard

HS-MMC interface

Capacity

8GB, 16GB, 32GB, 64GB, 128GB

Power Supply Voltage

2.7-3.6V        (Memory core)

1.7V-1.95V, 2.7V-3.6V  (Interface)

Bus Width

x1, x4, x8

Temperature Range

-25oC to +85oC

Package

153Ball FBGA

11.5mm x 13.0mm, 11.0mm x 10.0mm

Notes

[1] As of October 2, 2014. Toshiba survey. Excluding the 128GB product.
[2] e•MMCTM is a product category for a class of embedded memory products built to the JEDEC e•MMCTM Standard specification and is a trademark of the JEDEC Solid State Technology Association.
[3] Excluding the 128GB product.
[4] High-speed class e•MMCTM embedded NAND flash memory products using 19nm second generation process technology.
[5] “BKOPS control” is a function where the host allows the device to perform background operation during the device’s idle time. “Cache Barrier” is a function that controls when cache data is written to the memory chip. “Cache Flushing Report” is a function that informs the host if the device’s flushing policy is FIFO or not. “Large RPMB write” is a function that enhances the data size that can be written to the RPMB area to 8kB.
[6] HD and SD are calculated at average bit rates of 17Mbps and 7Mbps, respectively.
*The products are labeled based on the memory chip(s) it contains, not the amount of memory capacity available for data storage by the end user. Part of the capacity is reserved for card functionality. Please refer to the data sheet or your local Toshiba sales representative.(For purposes of measuring memory capacity in this context, 1GB = 1,073,741,824 bytes.)
*Read and write speeds are calculated as 1MB/s = 1,000,000bytes/s.
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Customer Inquiries:

Memory Marketing Division

Tel: +81-3-3457-3126

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Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.

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