Corporate Manufacturing Engineering Center: High-Density packaging technology

We have been developing microelectronics packaging design technology, process technology and microelectronics packaging equipment that meets the needs for high integration of electronic components and their high speed assembly. We also develop high-frequency modules operating in the microwave band and millimeter band that are essential for mobile and wireless devices.

High-frequency circuit design
Surface mount technology
Microelectroics packaging technology

High-frequency circuit design

RF circuits in the microwave and millimeter-wave frequency bands are used in cellular phones, television broadcast systems, etc. We are developing compact, high-performance and multifunctional RF circuits.

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Surface mount technology

We have been developing high-quality Jisso techniques, for example, 3D Jisso, curved surface Jisso, Jisso for extremely small chip components, for example, chips as small as 0.4 mm x 0.2 mm, and package Jisso with fine pitch electrodes. We are currently creating new systems and management processes for Jisso technologies.

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Microelectroics packaging technology

We have been developing microelectronics packaging design and process technologies for next-generation LSIs, power devices, optical devices, and MEMS devices.

Outline Environmentally Harmonized Technology Organization Location Core Manufacturing Technology		Core Manufactuing Technology > High-Density packaging technology We have been developing microelectronics packaging design technology, process technology and microelectronics packaging equipment that meets the needs for high integration of electronic components and their high speed assembly. We also develop high-frequency modules operating in the microwave band and millimeter band that are essential for mobile and wireless devices. High-frequency circuit design Surface mount technology Microelectroics packaging technology High-frequency circuit design RF circuits in the microwave and millimeter-wave frequency bands are used in cellular phones, television broadcast systems, etc. We are developing compact, high-performance and multifunctional RF circuits. Page Top Surface mount technology We have been developing high-quality Jisso techniques, for example, 3D Jisso, curved surface Jisso, Jisso for extremely small chip components, for example, chips as small as 0.4 mm x 0.2 mm, and package Jisso with fine pitch electrodes. We are currently creating new systems and management processes for Jisso technologies. Page Top Microelectroics packaging technology We have been developing microelectronics packaging design and process technologies for next-generation LSIs, power devices, optical devices, and MEMS devices.
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