Home > About Toshiba > Social and Environmental Activities > Environmental Management > Greening of Process > Mitigation of Climate Change: Greenhouse Gases other than CO₂
Toshiba Group aims to reduce the emissions of six types of GHGs covered by the Kyoto Protocol* by 36% by FY2010 and by 38% by FY2012, to 62% compared to the 2000 level. PFCs, which are used to produce semiconductors, and SF6, which is used to insulate heavy electric machinery, account for 90% of the Group's total emissions of GHGs other than energy-derived CO2 if they are combined. At its semiconductor plants, Toshiba Group is striving to shift to alternative gases with a smaller climate change potential and install GHG removal equipment in existing lines in a systematic way. In its heavy electric machinery division, the Group is making efforts to increase the collection and recycling rate for GHGs other than energy-derived CO2. As a result, in FY2010, Toshiba Group reduced emissions of GHGs other than energy-derived CO2 by 90,000 tons compared to the previous year's level and by 69% compared to the 2000 level, far exceeding the goal for the fiscal year. Future plans call for business expansion in the semiconductor and heavy electric machinery divisions, but in order to ensure further reduction in GHGs other than energy-derived CO2, the Group will actively take measures such as installing GHG removal equipment on a continuous basis and increasing GHG removal efficiency.



Changes in CO2 emissions from Fuchu Operations
The Fuchu Operations had used SF6 (whose global warming potential is 23,900 times as high as CO2) for vacuum valve testing systems, but reduced greenhouse gas emissions by 65% by developing a testing system that uses an alternative to the greenhouse gas. It was recognized by the Tokyo metropolitan government as an excellent business site for this accomplishment.
Toshiba Matsushita Display Technology Co., Ltd. has developed a fluorine (F2) gas-based cleaning process for the low-temperature polysilicon TFT LCD production line at its Ishikawa Works.
Previously, the company used nitrogen trifluoride (NF3), which was delivered in cylinders by a supplier. The newly installed system involves on-site production of F2 gas. As a result, CO2 emissions from the cleaning process, which could not be entirely eliminated in the case of NF3 gas even with the use of scrubbers, have been eliminated. Also, the on-site production of gas has lowered costs.
This is the first on-site F2 gas production system in Japan at an LCD or semiconductor manufacturing plant.
