Management of Chemicals for Products [Case Studies]

Halogen-free recycled plastics are used for the cover unit and other plastic parts, accounting for 56% of all plastics used in this product. Hazardous chemicals are reduced in various ways. [Compliance with the RoHS Directive]

• Extensive use of recycled plastics
• Lead-free soldering (printed circuit board)
• Abolition of hexavalent chromium plating (steel plate and screws)
• Use of PVC-free power cable for Japanese Model.

Among the measures Toshiba is implementing to reduce the use of hazardous substances is the use of substitutes for polyvinyl chloride (PVC) and brominated flame retardants (BFR), in addition to the abolition of the use of the six substances banned by the RoHS Directive.

Toshiba has applied PVC-free coating (high-intensity aluminum) for chassis casings of models introduced from fiscal 2006 onward. BFR previously used for substrates (excluding flexible substrates) and chassis has been replaced by magnesium alloy, a flame retardant that does not contain bromine.

• Details(A separate window will open.) (5 Sep. 2007)

For 0.85-inch HDD, Toshiba has abolished use of halogen-based flame retardant for all parts, such as LSIs, connectors, chip resistors, and diodes mounted on the printed circuit board, which is already halogen-free. Flexible substrates used at three locations are also switched to halogen-free materials. Toshiba intends to shift to halogen-free materials for 2.5-inch and 1.8-inch HDDs, too.

As a result of a survey to determine whether the six substances banned by the RoHS Directive were present in parts and materials procured from vendors and a corresponding switch to substitutes to eliminate them, this GIS is lead-free and halogen-free (wires, ducts, closing plates, etc.) and is zinc plated and treated with trivalent chromate. Joining of frames using bolts facilitates dismantling and recycling. Also, information on materials used for parts and components is documented and disclosed to facilitate sorting for recycling. Moreover, quantitative information on the product's environmental impacts based on life cycle assessment is disclosed. This is the industry's first EcoLeaf Environmental Label-certified switchgear.

For all mobile phones, regardless of whether they are destined for the Japanese market or overseas markets, we are endeavoring to abolish use of harmful substances, including the six substances specified by the RoHS Directive, from the initial development phase. Working in cooperation with parts manufacturers, Toshiba has dispensed with soldering and plating involving the use of harmful substances and now uses alternatives. In addition, environmental analysis of all parts and materials (including sub-materials) used in mobile phones has been conducted in collaboration with parts manufacturers to eliminate harmful substances. As a result, Toshiba is already shipping mobile phones in compliance with the RoHS Directive not only to Europe, but also in Japan and elsewhere in Asia.

In September 2005, earlier than the regulatory schedule, Toshiba started sales of notebook PCs that comply with the RoHS Directive. Technological expertise gained through the switch to lead-free soldering in 2001 led to this achievement. Also, Toshiba has found a unique solution to the problem of “whiskers” of narrow-pitch connectors, which has been a source of difficulty throughout the industry. All new PCs developed after solving the whisker problem are compliant with the RoHS Directive. As of March 2006, the entire line-up of Toshiba notebook PCs are RoHS compliant.

We are working to reduce the use specified chemical substances in various ways. For example, whereas Babbitt metal alloy was previously used to fix the ends of the cables from which an elevator is suspended, wedges are now used. As a result, use of lead has been reduced by about 8 tons per year. Also, changing the back-up battery used for printed circuit boards for remote monitoring from nickel cadmium to nickel hydride is expected to lead to a 10.4 kg reduction in the use of cadmium per year. We are also working to reduce electricity consumption. In line with the review of the ceiling design, lighting equipment has been optimized and lighting cover has been improved. As a result, power consumption for lighting has been reduced 33% while maintaining the same brightness in the elevator as in the case of the conventional design.

With the latest LCD module for notebook PCs, Toshiba has achieved reduced thickness, lighter weight, lower power consumption and elimination of the use of harmful substances, while maintaining the same performance as for the previous module. Use of LED as the light source for the backlight eliminates mercury. Combination with thin glass technology has resulted in a thickness of 2.75 mm, which is about half the thickness of the conventional module, and a weight of 146 g, a 35% reduction. Applying the industry-leading mass-production technology for low-temperature polysilicon TFT-LCD, a core technology of Toshiba, a flat structure has been realized in which the LCD display drive circuit board is placed on the same surface as the LCD display. The combination of thin LED backlight and glass polishing technology has led to the optimum LCD module for mobile notebook PCs.