The importance of structural design to ensure high reliability for information and telecommunication products is increasing. Design for impact durability has become essential as mobile products have become widespread.
Mobile products contain many parts assembled at high density, such as printed circuit boards, liquid crystal displays, and lithium ion batteries. On the other hand, mobile products have an intrinsic risk of being dropped on the ground or floor. If dropped, stress waves will be generated inside each part as the entire product deforms, which may cause severe damage and failure in these parts.
In usual reliability analysis with numerical simulation, detailed modeling can be performed only near particular evaluation points due to the computational load. However, it is desirable to apply detailed modeling to all parts in a mobile product in order to accurately assess complicated impact phenomena. Large-scale structural simulation may make such detailed modeling possible with the help of recent computer technologies. We incorporated the conventional reliability analysis method into a large-scale simulation and thus gained an overall picture of the physical process after the impact.
In this research, we chose a mobile phone as an example and demonstrated it is helpful for structural reliability design to figure out how transient stress waves run through all parts, as shown in the figure below.
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